flat package
英 [flæt ˈpækɪdʒ]
美 [flæt ˈpækɪdʒ]
扁平组件（外壳）
双语例句
- The Rhapsody solution is able to store model information in a flat or hierarchical fashion where each package in the model is represented as a directory in the file systems.
Rhapsody解决方案能够以平行的结构或者层级的结构存储模型信息，其中模型中的每一个包都作为文件系统中的目录显示。 - Bare copper flat wire technology is adopted for wire package, with H class insulant as bedding to realize functions like: quick heat dissipation, high efficiency and long working life.
线包采用丝包铜扁线技术工艺，用H级绝缘材料垫层，散热快、效率高、寿命长。 - Dual in line lead frame quad flat package
双列直插式引线框架四列直插式扁平外壳 - In this task, you add a flat file connection manager to the package that you just created.
在本任务中，将在刚创建的包中添加一个平面文件连接管理器。 - In this task, you will add and configure a flat file source to your package.
在此任务中，将向包中添加一个平面文件源并对其进行配置。 - Extension arbor for Morse taper bush without tang quad flat package
无扁尾莫氏锥套接长杆四列直插式扁平外壳 - The numerical detailed model and compact model were created for plastic quad flat package ( PQFP), and the accuracy of two models was verified by the measurement values.
建立了四边引线塑料扁平封装（PQFP，PlasticQuadFlatPackage）数值热模拟的详细模型和简化模型，实验验证了这两种模型的模拟精度。 - The QFN package ( Quad Flat No-lead Package), a new and developing technology for chip package, is a small footprint, low profile, surface mount, plastic encapsulated package with leads on the bottom.
QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。 - Status Quo and Development of The China Flat Glass Package
我国平板玻璃包装的现状与发展 - Tensile strength of the quad flat pack ( QFP) devices were determined by STR-1000 Joint Strength Tester and compared with the joints soldered with different pitches and different solder compositions QFP and SOP ( small outline package).
采用微焊点强度测试仪（STR-1000型）测试了方形扁平式封装器件（QFP）的抗拉强度，并对不同间距、不同钎料成分的QFP和SOP结构焊点进行了比较。 - Cutting and Forming Flat Bump Package
FBP平面凸点式封装 - Study on the impact of process parameters on the reliability of quad flat package solder joints based on shape prediction and plastic strain calculation
基于焊点形态预测与塑性应变计算的工艺参数对QFP焊点可靠性影响分析 - Quad Flat No-lead ( QFN) package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。 - The research in this thesis is supported by the National Natural Science Foundation Project. The structure and dimension parameters of Quad Flat no-lead package ( QFN) devices has been optimized and analyzed.
本文依托于国家自然科学基金项目微电子封装中的界面层裂失效和界面强度可靠性设计方法，对四方扁平无引脚封装（QFN）器件进行了结构尺寸参数优化和分析。